Special offer - Delivery now £4.99 when ordered onlineTergeo-EM plasma cleaner
Tergeo-EM has a unique design with a dual plasma source that enables both immersion and downstream plasma cleaning modes in one system. It is a truly versatile instrument for most EM laboratory plasma cleaning applications, such as TEM rod cleaning, hydrophobic-hydrophilic (glow discharge) conversion of TEM carbon support films, SEM specimen cleaning etc.
The large quartz chamber can be used for batch cleaning and the dual TEM rod adaptor enables cleaning of two TEM specimen holder rods.
Key benefits:
- Intuitive touchscreen operation – quick selection and running of recipes
- Direct and indirect plasma modes – process exactly matched to application
- Pulsed plasma and adjustable power output – optimal process control
- Unique plasma sensing – unsurpassed control of the plasma process
- Precise sensing of pressure and gas flow – optimal process control
- TEM rod adaptors – for cleaning two TEM rod holders in-vacuo
- Unique TEM grid holder – efficient and reliable hydrophilic conversion of carbon support films
- Adaptable design – for cleaning, plasma etching, ashing and surface modification
- Optional wafer vapour delivery kit (PIE-A122) for water vapour plasmas
Direct and indirect plasma cleaning modes
- Tergeo-EM downstream (indirect) mode with pulsed plasma provides a gentle processing method for delicate specimens with thin coatings, such as TEM holey carbon grids, heat and ESD sensitive devices, graphene, etc. It significantly reduces specimen heating and ion sputtering found in traditional direct mode plasma systems.
- Tergeo-EM immersion (direct mode) can be used for high-speed specimen cleaning, such as heavily contaminated SEM/TEM specimens and holders, photoresist ashing, ion sputtering treatment (cleaning before wire bonding, etc), and other high speed etching applications.
The Tergeo-EM has been chosen by universities and national laboratories, such as Caltech, NIH, Harvard, UC-Berkeley, NIST, NPL, University of Leeds, for electron microscopy applications, including for Cryo-TEM.
Download the Tergeo-EM brochure here.
Low energy plasma cleaning and surface modification for TEM and SEM
SEM users are familiar with the dark burn marks seen during imaging – these are caused by electron beam-induced deposition of organic contaminants (hydrocarbons). Due to the low secondary electron yield of carbon, hydrocarbon coated surfaces are usually much darker than clean surfaces - especially for secondary electron (SE) imaging at relatively low landing energies, such as 1000eV.
Hydrocarbon contamination on specimen surfaces can significantly reduce contrast at low landing energies and degrade image resolution, especially for high-resolution FE-SEM applications. To take full advantage of the high resolution capabilities of FE-SEM, it is important to remove hydrocarbon contamination from the specimen surfaces.
Tergeo-EM is also ideal for the hydrophobic-hydrophilic conversion (or rendering) of carbon coater TEM grids.
Fast, gentle cleaning of TEM holders, grids and specimens
Tergeo-EM plasma cleaner is designed for SEM/TEM specimen cleaning applications. The chamber cover will accept two TEM specimen rods from major TEM manufacturers. The chamber door has two viewing ports for the optimum process observation.
The Tergeo-EM plasma cleaner is extremely flexible and can also be used for cleaning SEM specimen stubs, holders, gun parts etc., which are placed on a convenient internal quartz plate for processing.
1. Large quartz specimen chamber. ID: 110mm, depth: 280mm
2. Front door locking groove. The door is firmly locked onto the chamber during the normal operation
3. Quartz specimen shelf with holes for the standard SEM stubs
4. Front door can easily be removed to provide access to the large specimen chamber
5. Two TEM specimen rods can be cleaned at the same time - simply remove the cap and insert the TEM rods
6. TEM grid holder option (and below)
The optional grid holder is used to clean 20 TEM grids per holder. Up to five holders can be placed directly on the quartz shelf, meaning up to 100 grids can be processed at one time.
To learn more about the principles behind RF plasma cleaning for SEM, TEM and FIB specimens, holders and chambers see: EM cleaning.
Unique RF plasma sensor technology
At the heart of Tergeo-EM is multiple process control technology which monitors and controls critical parameters such as pressure, plasma strength and mass flow control of gas input. Operation is fully automatic with an intuitive user interface featuring a 7" touch screen which makes operation as easy as a tablet device. The embedded microcontroller supports up to 20 customisable user recipes.
A key advantage of the Tergeo-EM is the integrated, patent-pending RF plasma sensing technology. Plasma strength is measured quantitatively and displayed in real time. The operator can use the plasma strength data as feedback to adjust gas flow rates and RF power to give desired cleaning speeds – ensuring repeatable and consistent results for users with beginner or expert levels of experience
Downstream cleaning recipe example Immersion cleaning recipe example
Immersion and downstream plasma cleaning - optimised for EM applications
Direct, immersion mode Indirect, downstream mode (e.g.TEM rod cleaning)
Immersion mode - for high-speed cleaning and etching
Uniquely, the Tergeo-EM has two integrated RF plasma sources in one instrument - an in-situ source and a remote source. When the plasma is generated inside the main specimen chamber, it is referred to as immersion mode processing and specimens are subject to both energetic ion bombardment and chemical reactions with neutral radical species. Immersion mode processing is required for high-speed etching and surface modification.
Downstream mode - for TEM and SEM specimens and other delicate specimens
For TEM and SEM specimens and holders and specimens such as thin gate oxides, ESD sensitive devices, anti-reflective coatings, graphene, carbon nanotubes, DLC (diamond-like-carbon), immersion mode processing may cause irreversible damage. In these cases gentle downstream processing mode is essential. Here the plasma generation takes place inside a remote chamber attached to the side of the main chamber. In this downstream mode only neutral, lower energy radical species generated inside the remote plasma source can diffuse into the main chamber and react with specimens. This ensures there is no ion sputtering damage to delicate specimens. For TEM and SEM applications air or an argon/oxygen mixture (80/20%) is typcially used.
Pulsed RF cleaning mode - for gentler, damage-free plasma cleaning
Research has shown that RF plasma reaction rates can be maintained in pulsed operation, despite a lower more "specimen friendly" average power. Using pulsed operation (the Tergeo series uses 480Hz) can reduce "dust" particle formation, trenching, notching and charging. For fluorocarbon PECVD process, pulsed operation can yield rougher surface structure and thereby give greater hydrophobicity.
To learn more about the principles behind RF plasma cleaning for SEM, TEM and FIB specimens, holders and chambers see: EM cleaning.
Specification
RF Power. There are two options: 0-75W or 0-150W, 13.56mHz high frequency RF power with automatic impedance matching of in-situ plasma source
Two process modes. Dual plasma source. Immersion (direct) plasma for high-speed cleaning, etching and surface modification. Remote (indirect) plasma for gentle surface contamination removal and
hydrophobic-hydrophilic conversion of carbon support films
Pulsed plasma. Continuous or pulsed plasma, cycle time: 2ms. Pulse ratio: 0.4% to 100%. Controlled by setting the duty ratio (0-255) to generate plasma with average RF power down to less than 0.25W
Automatic plasma strength sensor technology (patent pending). Monitors both direct and remote plasma sources. Plasma strengths are monitored and displayed in real-time on the central display
Automatic sensing and process control. For pressure, temperature, gas-flow rates and plasma strength. With automatic impedance matching
Operating pressure. 0.007-1.33mbar
Pumping. Edwards premium dry scroll pump
Vacuum gauge. Premium corrosion-resistant pressure sensor
Process gas control. Two mass flow controllers (MFC) for controlled gas flow (0~100sccm) fitted as standard. ¼ inch Swagelok compression fitting connectors. A third MFC is optional (see accessories)
Plasma chamber door with rod adaptors. Accepts two TEM rod holders (of your choice). The door has two quartz observation windows to allow viewing of the chamber and plasma colour
Quartz chamber door and shelf. ID: 110mm, depth: 280mm. Includes a quartz specimen shelf
Port for venting and purging. With clean dry air or other gases
Graphical user interface. With easy to use 7” resistive touchscreen. Up to 20 customisable recipes. Setting of all key process parameters. Help menu.
Dimensions. 450mm (W) x 250mm (H) x 430mm (D) excluding pump
Electrical requirements. AC power 100~230V, 50/60Hz.The applicable European Community requirements for product safety are specified in EMC Directive 2004/108/EC and the Low Voltage Directive 2006/95/EC.
Remote diagnostics. Remote online support and diagnostics. Tergeo-EM has a “Serial to PC” port for control from a PC user interface through RS232 communication port.
Warranty. Two years
For a safe, clean and convenient way to store multiple TEM rods see: TEM rod vacuum storage station
Tergeo-EM RF plasma cleaner ordering information
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Pumping requirement - scroll pump recommended
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 Suitable for XDS pumps that are not connected to a house exhaust system. The A50597000 also gives exhaust filtration. Flange size NW25 and includes NW25 o-ring, o-ring carrier and clamp. Rated flow 11m3 h-1 |
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 Edwards nXDS6i dry scroll vacuum pump. Peak pumping speed: 6.2 m3h-1 . Suitable for applications where oil-based rotary pumps need to be avoided. |
Tergeo-EM optional accessories
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 3nm Dust particle filter for using room air as process gas and/or vent the chamber |
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 Adjustable vent flow rate control valve for Tergeo-EM, Tergeo and Tergeo-Plus. Reduces the venting gas flow rate to prevent light or powder samples from being blown away |
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 Water vapour delivery kit for generating water vapour plasma, creating super hydrophilic surfaces with high density OH* functional groups on surface. |
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 Upgrade from standard 75W to 150W RF power supply |
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A third mass flow controller (MFC) required if three gases are used. |
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 Front door option for Tergeo-EM. Can be easily interchanged with the standard rod door for easier access for TEM grid cleaning and processing of other samples (SEM samples etc) |